Isolation structure and manufacturing method thereof for high-voltage device in a high-voltage bcd process

ABSTRACT

The invention provides an isolation structure and a manufacturing method thereof for a high-voltage device in a high-voltage BCD process, the isolation structure comprising: a semiconductor substrate having a first type of doping; an epitaxial layer having a second type of doping over the semiconductor substrate, wherein the first type of doping is opposite to the second type of doping; an isolation region having the first type of doping, wherein the isolation region extends through the epitaxial layer into the semiconductor substrate, and wherein the isolation region has a doping concentration on the same order as a doping concentration of the epitaxial layer; a field oxide layer over the isolation region. This invention effectively isolates the epitaxial island where the BCD high-voltage device is located, thereby increasing the breakdown voltage of the high-voltage device in the BCD process. Further, with a minimum thickness of the field oxide layer, the parasitical threshold voltage between the aluminum wiring and the silicon surface of the high-voltage device can be higher than 1200V, thereby improving the planarization of oxide layer steps on the silicon surface in the whole high-voltage BCD process, and enhancing the reliability of the product.

TECHNICAL FIELD

This invention relates to an isolation structure and a manufacturingmethod thereof for a high-voltage device in a high-voltage BCD process,and more particularly, to an isolation structure and a manufacturingmethod thereof for a high-voltage device in a high-voltage BCD processon an order of 1200V.

BACKGROUND

BCD process is a monolithic integrated processing technique, which canfabricate Bipolar, CMOS and DMOS devices on the same chip, and is simplyreferred to as BCD process. Since the BCD process incorporates therespective advantages of the three devices above, it becomes a leadingprocessing technique in the integrated circuits. The BCD processingtechnique has been developed for many years and has many provenprocessing solutions. The BCD process may select different devices fordifferent circuits to optimize the respective electric circuit devices,achieving the requirements of low power-consumption, high integration,high speed, and high driving capacity of the whole circuit. The BCDprocess is an excellent choice for IC manufacture process such as powermanagement, display driving, auto electronics, etc., and has a widemarket prospect.

As the enhancement of the national energy saving and consumptionreducing, the high-power semiconductor discrete device industry developscontinuously, quickly and steadily, and the industry scale isincreasing. The electrical and electronic power modules and componentswith a high-voltage integrated circuit as a core high-voltage powerswitch device are applied more and more widely, and are progressing inthree different research directions of high voltage, high power, andhigh density. For example, the high-voltage integrated circuit in theinverter motor driving circuit for the three-phase AC 380V, 440V, and480V power supply employs a 1200V high-voltage BCD process product. Forthe 1200V high-voltage BCD process, besides the development of theessential 1200V high-voltage LDMOS devices, it is also necessary todevelop an isolation structure to effectively isolate the epitaxialisland where the high-voltage device is located. Meanwhile, aparasitical effect caused to the silicon surface by the high voltage onthe aluminum wiring of the high-voltage device must be considered, e.g.,the parasitical threshold voltage between aluminum wiring and thesilicon surface of the 1200V device must be higher than 1200V.

SUMMARY

This invention intends to solve the technical problem of providing anisolation structure and a manufacturing method thereof for ahigh-voltage device in a high-voltage BCD process, so as to effectivelyisolates the epitaxial island where the BCD high-voltage device islocated, and to increase the breakdown voltage of the high-voltagedevice in the BCD process, such as LDMOS transistors, etc. Further, witha minimum thickness of the field oxide layer, the parasitical thresholdvoltage between the aluminum wiring and the silicon surface of thehigh-voltage device can be higher than 1200V, thereby improving theplanarization of oxide layer steps on the silicon surface in the wholehigh-voltage BCD process, and enhancing the reliability of the product.

To solve the technical problem above, the invention provides anisolation structure for a high-voltage device in a high-voltage BCDprocess, comprising:

a semiconductor substrate having a first type of doping;

an epitaxial layer having a second type of doping over the semiconductorsubstrate, wherein the first type of doping is opposite to the secondtype of doping;

an isolation region having the first type of doping, wherein theisolation region extends through the epitaxial layer into thesemiconductor substrate, and wherein the isolation region has a dopingconcentration on the same order as a doping concentration of theepitaxial layer; and

a field oxide layer over the isolation region.

Optionally, when the high-voltage device breaks down, charges in theisolation region and an epitaxial island where the high-voltage deviceis located are completely depleted, wherein the epitaxial island refersto the epitaxial layer between adjacent isolation regions.

Optionally, the field oxide layer has a thickness of 6000˜18000 Å.

Optionally, the epitaxial layer is a stacked structure.

Optionally, the epitaxial layer is a stacked structure with 2 layers,including stacked first epitaxial layer and second epitaxial layer.

Optionally, the first epitaxial layer has a thickness of 3.0˜15.0 μm anda resistivity of 1.0˜10 Ω·cm; the second epitaxial layer has a thicknessof 3.0˜15.0 μm and a resistivity of 1.0˜4.0 Ω·cm.

Optionally, the first type of doping is P-type, and the second type ofdoping is N-type.

Optionally, the isolation structure further comprises:

an isolation surface region of the first type of doping located on asurface of the epitaxial layer beneath the field oxide layer.

The invention also provides a method for manufacturing an isolationstructure for a high-voltage device in a high-voltage BCD process,comprising:

providing a semiconductor substrate having a first type of doping;

forming an epitaxial layer having a second type of doping over thesemiconductor layer, and forming an isolation region having the firsttype of doping in the epitaxial layer, wherein the isolation layerextends through the epitaxial layer into the semiconductor substrate,wherein the isolation region has a doping concentration on the sameorder as the epitaxial layer, and the first type of doping is oppositeto the second type of doping; and

forming a field oxide layer over the isolation region.

Optionally, the field oxide layer has a thickness of 6000˜18000 Å.

Optionally, the epitaxial layer is a stacked structure.

Optionally, the epitaxial layer is a stacked structure with 2 layers,wherein the epitaxial layer and the isolation region are formed by aprocess including:

performing ion implantation to the semiconductor substrate to formtherein a first buried layer of the first type of doping and a secondburied layer of the second type of doping;

growing a first epitaxial layer over the semiconductor substrate,wherein the first epitaxial layer covers the first buried layer and thesecond buried layer;

locating with a lithography mask and implanting ions of the first typeof doping into the first epitaxial layer, to form a first isolationregion;

annealing the first isolation region;

growing a second epitaxial layer over the first epitaxial layer;

locating with a lithography mask and implanting ions of the first typeof doping into the second epitaxial layer, to form a second isolationregion; and

annealing the second isolation region, such that the second isolationregion, the first isolation region and the first buried layer joint insequence to form the isolation region.

Optionally, the ions implanted into the first buried layer are boronions with an implanting energy of 60˜100 KeV and an implantation dosageof 1E12˜1E14/cm².

Optionally, the ions implanted into the first isolation region are boronions with an implanting energy of 60˜100 KeV and an implantation dosageof 1E12˜1E14/cm².

Optionally, the ions implanted into the second isolation region areboron ions with an implanting energy of 60˜100 KeV and an implantationdosage of 1E12˜1E14/cm².

Optionally, the first epitaxial layer has a thickness of 3.0˜15.0 μm anda resistivity of 1.0˜10 Ω·cm, the second epitaxial layer has a thicknessof 3.0˜15.0 μm and a resistivity of 1.0˜4.0 Ω·cm.

Optionally, the first type of doping is P-type, and the second type ofdoping is N-type.

Optionally, prior to forming the field oxide layer, the method furthercomprises:

locating with a mask and implanting ions of the first type of dopinginto a surface of the epitaxial layer to form an isolation surfaceregion, wherein the field oxide layer is located over the isolationsurface region.

Optionally, the ions implanted into the isolation surface region areboron ions with an implanting energy of 25˜50 KeV and an implantationdosage of 5E13˜5E14/cm².

As compared with the prior art, the invention has the followingadvantages:

In the isolation structure and manufacturing method thereof for ahigh-voltage device in a high-voltage BCD process according to anembodiment of the invention, the isolation region has a dopingconcentration on the same order as a doping concentration of theepitaxial layer, such that the concentration of an epitaxial islandbetween isolation regions nearly reaches a balanced state with theisolation region. When the device breaks down at a high-voltage, chargesin the isolation region and the epitaxial island where the high-voltagedevice is located are almost completely depleted, such that thebreakdown point of the high-voltage device on the epitaxial islandoccurs on the vertical epitaxial junction surface, thereby increasingthe breakdown voltage of the devices such as LDMOS transistor.

Further, since the doping concentration of the isolation region in anembodiment of this invention is lower than that of a conventionalisolation junction, the carrier concentration is lower accordingly.Moreover, when a device breaks down at a high-voltage, the charges inthe isolation region will almost be completely depleted. It is knownfrom the CV theory for a MOS capacitor that, with a lower carrierconcentration, the oxide layer of the MOS capacitor may be thinner atthe same threshold voltage. For example, in a 1200V order high-voltageBCD process, the thickness of the field oxide layer under the aluminumwiring of the high-voltage device may be smaller, and the isolationstructure can still withstand a parasitical breakdown voltage of 1200V,thereby improving the planarization of the oxide layer steps on thesilicon surface in the whole high-voltage BCD process, and enhancing thereliability of the product.

Additionally, the isolation structure in an embodiment of this inventionis made separately on the vertical direction, and is formed by jointinga buried layer in the semiconductor substrate and isolation regions inmultiple epitaxial layers, which can reduce the lateral diffusion sizeof the isolation region, thereby saving the footprint area. Moreover,for an isolation region of P-type doping, an isolation surface region ofP-type doping may be formed under the field oxide layer to prevent theelectric leakage phenomena of the isolation structure caused by decreaseof the surface impurity concentration of the isolation structure due tothe boron adsorption effect in forming the field oxide layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic flowchart of a method for manufacturing anisolation structure for a high-voltage device in a high-voltage BCDprocess according to an embodiment of the invention;

FIGS. 2-8 are cross-sectional structural schematic diagramscorresponding to various steps of a method for manufacturing anisolation structure for a high-voltage device in a high-voltage BCDprocess according to an embodiment of the invention.

DETAILED DESCRIPTION

The invention is further described in conjunction with the followingspecific embodiments and the drawings, although the scope of theinvention is not so limited.

FIG. 1 shows a schematic flowchart of a method for manufacturing anisolation structure for a high-voltage device in a high-voltage BCDprocess according to an embodiment of the invention. The methodcomprises:

Step S11, providing a semiconductor substrate having a first type ofdoping;

Step S12, forming an epitaxial layer having a second type of doping overthe semiconductor layer, and forming an isolation region having thefirst type of doping in the epitaxial layer, wherein the isolation layerextends through the epitaxial layer into the semiconductor substrate,wherein the isolation region has a doping concentration on the sameorder as the epitaxial layer, and the first type of doping is oppositeto the second type of doping; and

Step S13, forming a field oxide layer over the isolation region.

The first type of doping is one of P-type doping and N-type doping, andthe second type of doping is the other of P-type doping and N-typedoping. In this embodiment, the first type of doping is P-type doping,and the second type of doping is N-type doping. However, those skilledin the art should understand, the above two types of doping areinterchangeable.

The method for manufacturing an isolation structure for a high-voltagedevice in a high-voltage BCD process according to an embodiment of theinvention is described in details below in conjunction with FIG. 1 andFIGS. 2-8.

Initially, refer to FIG. 2, a semiconductor substrate 10 of P-typedoping is provided, in which a first buried layer 12 of P-type dopingand a second buried layer 11 of N-type doping are formed.

The semiconductor substrate 10 may be, e.g., a silicon substrate havinga crystal orientation of <100> and a resistivity of 10˜300 Ω·cm. Theinitially oxidized oxide layer has a thickness selective between 0.2˜0.6μm.

The first buried layer 12 and the second buried layer 11 may be formedin a process comprising: locating a region for the second buried layer11 of N-type doping with a lithography mask, then performing ionimplantation, wherein the implanted ions may be for example antimonyions, the implanting energy may be 60 KeV, and the implantation dosageis selective between 1E15˜2E15/cm², then annealing at an annealingtemperature selective between 1200˜1250° C. for a time durationselective between 0.5˜2 H; locating a region for the first buried layer12 of P-type doping with a lithography mask, then performing ionimplantation, wherein the implanted ions may be for example boron ions,the implanting energy may be 60˜100 KeV, and the implantation dosage isselective between 1E12˜1E14/cm², then annealing at an annealingtemperature selective between 1000˜1100° C. for a time durationselective between 0.5˜2 H. The first buried layer 12 of P-type doping isa first layer of the isolation region.

Refer to FIG. 3, a first epitaxial layer 13 of N-type doping is grownover the semiconductor substrate 10, the first epitaxial layer 13covering the first buried layer 12 and the second buried layer 11. Inparticular, it may include: cleaning with HF acid of 1:10˜1:20 prior toforming the first epitaxial layer 13, then growing the first epitaxiallayer 13 having a thickness of 3.0˜15.0 μm and a resistivity of 1.0˜10Ω·cm.

Refer to FIG. 4, ions are implanted into the first epitaxial layer 13 toform a first isolation region 14 of P-type doping, which serves as asecond layer of the isolation region. In particular, it may include:growing a thin oxide layer with a thickness selective between 300 Å to600 Å; then locating the first isolation region 14 with a lithographymask and performing ion implantation, wherein the implanted ions may befor example boron ions, the implanting energy may be 60˜100 KeV, and theimplantation dosage is 1E12˜1E14/cm²; then annealing at an annealingtemperature selective between 1000˜1100° C. for a time durationselective between 0.5˜2 H.

Refer to FIG. 5, a second epitaxial layer 15 of N-type doping is grownover the first epitaxial layer 13. In particular, it may include:cleaning with HF acid of 1:10˜1:20 prior to growing the second epitaxiallayer 15, then growing the second epitaxial layer 15 with a method suchas epitaxial growth, the second epitaxial layer 15 having a thickness of3.0˜15.0 μm and a resistivity of 1.0-4.0 Ω·cm.

Refer to FIG. 6, ions are implanted into the second epitaxial layer 15to form a second isolation region 16 of P-type doping therein, whichserves as a third layer of the isolation region. In particular, it mayinclude: growing a thin oxide layer with a thickness selective between300 Å˜600 Å; then locating a region for the second isolation region 16with a lithography mask and performing ion implantation, wherein theimplanted ions may be for example boron ions, the implanting energy maybe 60˜100 KeV, and the implantation dosage is selective between1E12˜1E14/cm²; then annealing at an annealing temperature selectivebetween 1000˜1100° C. for a time duration selective between 0.5˜2 H, andthen annealing for 2˜8 H respectively in a nitrogen atmosphere and anoxygen atmosphere at a temperature of 1200° C., such that the secondisolation region 16, the first isolation region 14 diffuse to joint insequence, thereby forming an isolation region which contacts with thefirst buried layer 12. After pushing the junction by annealing, theisolation region (including the first isolation region 14 and the secondisolation region 16) has a doping concentration on the same order as thefirst epitaxial layer 13 and the second epitaxial layer 15.

Refer to FIG. 7, a pad oxide layer (e.g., with a material of SiO₂) 101may be grown on the second epitaxial layer 15, and a local oxidationdielectric layer (e.g., with a material of SiN) 102 may be formed overthe pad oxide layer 101, wherein the pad oxide layer 101 has a thicknessselective between 250˜400 Å, and the local oxidation dielectric layer102 has a thickness selective between 1000˜1500 Å; then an oxidationregion is located with an active region lithography mask, and a localoxidation region is etched with a method such as dry etching.

Then, lithography may be performed with an isolation mask, and aphotoresist and the local oxidation dielectric layer 102 are used as amasking layer to perform ion implantation onto the surface of the secondepitaxial layer 15, in order to form an isolation surface region 17 ofP-type doping, wherein the implanted ions may be boron ions, theimplanting energy may be 25˜50 KeV, and the implantation dosage is5E13˜5E14/cm². The isolation surface region 17 may be used as a fourthlayer of the isolation region.

Then refer to FIG. 8, a field oxide layer 18 is formed over theisolation surface region 17, e.g., by Local Oxidation of Silicon(LOCOS), the field oxide layer 18 having a thickness of 6000˜18000 Å.Meanwhile, annealing is performed for the implantation of the isolationsurface region 17.

It should be noted that, in this embodiment, the first isolation region14 and the second isolation region 16 are of P-type doping. To preventthe surface doping concentration of the isolation structure fromdecreasing due to the boron adsorption effect in forming the field oxidelayer 18, the isolation surface region 17 may be formed under the fieldoxide layer 18, so as to increase the doping concentration of theisolation structure. If the first isolation region 14 and the secondisolation region 16 are of N-type doping, the isolation surface region17 is unnecessary, thus the field oxide layer 18 may be formed directlyon the second isolation region 16.

Then, devices, such as LDMOS transistors, etc., may be manufactured asin a normal BCD process.

So far, the isolation structure formed in this embodiment is asillustrated in FIG. 8, comprising: a substrate of P-type doping; anepitaxial layer of N-type doping (including stacked first epitaxiallayer 13 and second epitaxial layer 15 in this embodiment) over thesemiconductor layer 10; an isolation region of P-type doping (includingthe isolation surface region 17, the second isolation region 16, thefirst isolation region 14, and the first buried layer 12 in thisembodiment), wherein the isolation region extends through the epitaxiallayer into the semiconductor substrate 10, wherein the isolation regionhas a doping concentration on the same order as the doping concentrationof the epitaxial layer; and a field oxide layer 18 over the isolationregion, in particular over the isolation surface region 17 in thisembodiment.

When a high-voltage device breaks down, the charges in the isolationregion and the epitaxial island where the high-voltage device is locatedwill be completely depleted, wherein the epitaxial island refers to theepitaxial layer between adjacent isolation regions. It should be notedthat, the charges being completely depleted includes a situation wherethe charges are nearly depleted within an acceptable error range.

In this embodiment, the first epitaxial layer 13 and the secondepitaxial layer 15 collectively form a stacked epitaxial layer, and thefirst buried layer 12 is formed in the semiconductor substrate. Aftereach epitaxial layer is formed, ion implantation is performed therein toform a corresponding isolation region. Then, the junction is pushed anddiffused by annealing, such that the isolation region in each epitaxiallayer as well as the first buried layer 12 joint with each other to forma complete isolation region. However, those skilled in the art shouldunderstand, the number of stacked layers in the epitaxial layer is notlimited to 2 layers, but may be for example 1 layer, 3 layers, etc.

The technical scheme of this embodiment may implement LDMOS transistorson an order of 1200V and high-voltage devices on an order of 1200V to anintegrated isolation structure, and is applicable to high-voltage BCDprocess above 1200V. The isolation region is formed by performingepitaxy and ion implantation each twice, thereby reducing the lateraldiffusion size, and saving the footprint area. Meanwhile, the formationof the isolation surface region may prevent the electric leakagephenomena caused by decrease of the surface impurity concentration ofthe isolation region due to the boron adsorption effect in forming thefield oxide layer.

In addition, the doping concentration in the isolation region and thedoping concentration in the epitaxial island may be adjusted to anear-balanced state by the process. When a high-voltage device breaksdown, the charges in the isolation region and the epitaxial island wherethe high-voltage device is located will almost be completely depleted,such that the breakdown point of the high-voltage device on theepitaxial island occurs on the vertical epitaxial junction surface,thereby increasing the breakdown voltage of the 1200V high-voltage LDMOStransistor.

Further, since the doping concentration of the whole isolation region islower than a conventional isolation structure, the carrier concentrationis lower. When a device breaks down at a high-voltage, the charges inthe isolation region will almost be completely depleted. It is knownfrom the CV theory for a MOS capacitor that, with a lower carrierconcentration, the oxide layer of the MOS capacitor may be made thinnerat the same threshold voltage. That is, for a 1200V high-voltage BCDisolation structure, the thickness of the field oxide layer under thealuminum wiring of the high-voltage device may be smaller, and theisolation region can still withstand a parasitical breakdown voltage of1200V, thereby improving the planarization of oxide layer steps on thesilicon surface in the whole high-voltage BCD process, and enhancing thereliability of the product.

Although the invention has been disclosed above with preferredembodiments, which are not intended to limit the invention. Possiblevariations and modifications can be made by those skilled in the artwithout departing from the spirit and scope of the invention.Accordingly, the scope of the invention is defined by the Claims of theinvention.

1. An isolation structure for a high-voltage device in a high-voltageBCD process, comprising: a semiconductor substrate having a first typeof doping; an epitaxial layer having a second type of doping over thesemiconductor substrate, wherein the first type of doping is opposite tothe second type of doping; an isolation region having the first type ofdoping, wherein the isolation region extends through the epitaxial layerinto the semiconductor substrate, and wherein the isolation region has adoping concentration on the same order as a doping concentration of theepitaxial layer; and a field oxide layer over the isolation region. 2.The isolation structure for the high-voltage device in the high-voltageBCD process of claim 1, wherein when the high-voltage device breaksdown, charges in the isolation region and an epitaxial island where thehigh-voltage device is located are completely depleted, wherein theepitaxial island refers to an epitaxial layer between adjacent isolationregions.
 3. The isolation structure for the high-voltage device in thehigh-voltage BCD process of claim 1, wherein the field oxide layer has athickness of 6000˜18000 Å.
 4. The isolation structure for thehigh-voltage device in the high-voltage BCD process of claim 1, whereinthe epitaxial layer is a stacked structure.
 5. The isolation structurefor the high-voltage device in the high-voltage BCD process of claim 4,wherein the epitaxial layer is a stacked structure with 2 layers,including stacked first epitaxial layer and second epitaxial layer. 6.The isolation structure for the high-voltage device in the high-voltageBCD process of claim 5, wherein the first epitaxial layer has athickness of 3.0˜15.0 μm and a resistivity of 1.0˜10 Ω·cm, the secondepitaxial layer has a thickness of 3.0˜15.0 μm and a resistivity of1.0˜4.0 Ω·cm.
 7. The isolation structure for the high-voltage device inthe high-voltage BCD process of claim 1, wherein the first type ofdoping is P-type, and the second type of doping is N-type.
 8. Theisolation structure for the high-voltage device in the high-voltage BCDprocess of claim 7, further comprising: an isolation surface region ofthe first type of doping located on a surface of the epitaxial layerbeneath the field oxide layer.
 9. A method for manufacturing anisolation structure for a high-voltage device in a high-voltage BCDprocess, comprising: providing a semiconductor substrate having a firsttype of doping; forming an epitaxial layer having a second type ofdoping over the semiconductor layer, and forming an isolation regionhaving the first type of doping in the epitaxial layer, wherein theisolation layer extends through the epitaxial layer into thesemiconductor substrate, wherein the isolation region has a dopingconcentration on the same order as a doping concentration of theepitaxial layer, and the first type of doping is opposite to the secondtype of doping; and forming a field oxide layer over the isolationregion.
 10. The method for manufacturing the isolation structure for thehigh-voltage device in the high-voltage BCD process of claim 9, whereinthe field oxide layer has a thickness of 6000˜18000 Å.
 11. The methodfor manufacturing the isolation structure for the high-voltage device inthe high-voltage BCD process of claim 9, wherein the epitaxial layer isa stacked structure.
 12. The method for manufacturing the isolationstructure for the high-voltage device in the high-voltage BCD process ofclaim 11, wherein the epitaxial layer is a stacked structure with 2layers, wherein the epitaxial layer and the isolation region are formedby: performing ion implantation to the semiconductor substrate to formtherein a first buried layer of the first type of doping and a secondburied layer of the second type of doping; growing a first epitaxiallayer over the semiconductor substrate, wherein the first epitaxiallayer covers the first buried layer and the second buried layer;locating with a lithography mask and implanting ions of the first typeof doping into the first epitaxial layer, to form a first isolationregion; annealing the first isolation region; growing a second epitaxiallayer over the first epitaxial layer; locating with a lithography maskand implanting ions of the first type of doping into the secondepitaxial layer, to form a second isolation region; and annealing thesecond isolation region, such that the second isolation region, thefirst isolation region and the first buried layer joint in sequence toform the isolation region.
 13. The method for manufacturing theisolation structure for the high-voltage device in the high-voltage BCDprocess of claim 12, wherein the ions implanted into the first buriedlayer are boron ions with an implanting energy of 60˜100 KeV and animplantation dosage of 1E12˜1E14/cm².
 14. The method for manufacturingthe isolation structure for the high-voltage device in the high-voltageBCD process of claim 12, wherein the ions implanted into the firstisolation region are boron ions with an implanting energy of 60˜100 KeVand an implantation dosage of 1E12˜1E14/cm².
 15. The method formanufacturing the isolation structure for the high-voltage device in thehigh-voltage BCD process of claim 12, wherein the ions implanted intothe second isolation region are boron ions with an implanting energy of60˜100 KeV and an implantation dosage of 1E12˜1E14/cm².
 16. The methodfor manufacturing the isolation structure for the high-voltage device inthe high-voltage BCD process of claim 12, wherein the first epitaxiallayer has a thickness of 3.0˜15.0 μm and a resistivity of 1.0˜10 Ω·cm,the second epitaxial layer has a thickness of 3.0˜15.0 μm and aresistivity of 1.0˜4.0 Ω·cm.
 17. The method for manufacturing theisolation structure for the high-voltage device in the high-voltage BCDprocess of claim 9, wherein the first type of doping is P-type, and thesecond type of doping is N-type.
 18. The method for manufacturing theisolation structure for the high-voltage device in the high-voltage BCDprocess of claim 17, wherein prior to forming the field oxide layer, themethod further comprises: locating with a mask and implanting ions ofthe first type of doping into a surface of the epitaxial layer to forman isolation surface region, wherein the field oxide layer is locatedover the isolation surface region.
 19. The method for manufacturing theisolation structure for the high-voltage device in the high-voltage BCDprocess of claim 18, wherein the ions implanted into the isolationsurface region are boron ions with an implanting energy of 25˜50 KeV andan implantation dosage of 5E13˜5E14/cm².
 20. The isolation structure forthe high-voltage device in the high-voltage BCD process of claim 3,wherein the epitaxial layer is a stacked structure.